The System Designer's Guide to: System Analysis
Electromagnetic Interference and Thermal Analysis of Electronic Systems
by Brad Griffin, Cadence
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About the Book
Data is driving disruptive industries and trends, with 90 percent having been generated in only the last two years. 80 percent of this data is unstructured and only 2 percent of this data has been analyzed.
System-level analysis of complex and high-speed electronic designs is critical to solve electromagnetic, electrothermal, and electromechanical simulation challenges and to ensure that the system works under wide-ranging operating conditions.
The electrothermal analysis of ICs and electronic systems is made more complex by interconnected electrical and thermal effects. Increased electrical content logically generates more heat, which affects the system performance of electronic devices. In this book, the author focuses on EM and thermal analysis in the context of data center electronics systems.
System-level analysis of complex and high-speed electronic designs is critical to solve electromagnetic, electrothermal, and electromechanical simulation challenges and to ensure that the system works under wide-ranging operating conditions.
The electrothermal analysis of ICs and electronic systems is made more complex by interconnected electrical and thermal effects. Increased electrical content logically generates more heat, which affects the system performance of electronic devices. In this book, the author focuses on EM and thermal analysis in the context of data center electronics systems.
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About the Creator
IPC Publishing Group, Inc.
Bannockburn, IL
IPC Publishing Group, Inc. dba I-Connect007, is dedicated to educating and informing the electronics interconnect supply chain community with content worth sharing. I-007eBooks was launched in 2017 with a micro eBook "guide to" series. I-007eBooks.com is the library for our main site, I-Connect007.com.